Heat transfer for power modules

ABSTRACT

In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heatsink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus can include a cover including a channel where the plurality of protrusions of the heatsink are disposed within the channel, and can include a sealing mechanism disposed between the cover and the module.

TECHNICAL FIELD

This description generally relates to heat transfer technologies relatedto modules.

BACKGROUND

In general, a heatsink can transfer heat generated by electroniccomponents included in a power supply to, for example, an air coolant.By transferring or directing heat away from the electronic components,the temperature of the electronic components can be regulated todesirable levels. Regulating the temperature of the electroniccomponents to avoid overheating can also prevent damage to theelectronic components. Any overheating of or damage to the electroniccomponents in the power supply can negatively impact the performance ofthe power supply and, in some cases, can result in the complete failureof the power supply. The heatsinks used in some technologies may not bedesirable for certain applications.

SUMMARY

In one general aspect, an apparatus can include a module including asemiconductor die. The apparatus can include a heatsink coupled to themodule and including a substrate, and a plurality of protrusions. Theapparatus can include a cover including a channel where the plurality ofprotrusions of the heatsink are disposed within the channel, and caninclude a sealing mechanism disposed between the cover and the module.

The details of one or more implementations are set forth in theaccompanying drawings and the description below. Other features will beapparent from the description and drawings, and from the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A through 1E are diagrams that illustrate various views of amodule assembly.

FIGS. 2A and 2B are diagrams that illustrate a variation of the moduleassembly shown in FIGS. 1A through 1E.

FIG. 3 is a diagram that illustrates a variation of the protrusionsshown in FIG. 2B.

FIGS. 4A through 4F are diagrams that illustrate variations of themodule assemblies shown in FIGS. 1A through 3.

FIGS. 5 through 9B are diagrams that illustrate variations of moduleassemblies.

FIGS. 10 and 11 illustrate examples of heatsinks.

FIG. 12 is a diagram that illustrates a variation of the module assemblyshown in FIG. 6.

FIG. 13 illustrates an exploded view of components included in a moduleassembly.

FIG. 14 is a diagram that illustrates a side view of an example moduleassembly that can be a variation of the module assembly shown in FIG.13.

FIGS. 15 and 16 illustrate side cross-sectional views of example moduleassemblies.

FIG. 17 is a diagram that illustrates example covers.

FIGS. 18A through 18H illustrate a method of manufacturing at least someof the heatsink-based module assemblies described herein.

FIGS. 19A through 19F illustrate another method of manufacturing atleast some of heatsink-based module assemblies described herein.

FIGS. 20A through 20D illustrate a method of manufacturing at least someof cover-protrusion module assemblies described herein.

FIG. 21 is a diagram that illustrates an example module.

FIG. 22 is a flowchart that illustrates a method for manufacturing themodule assemblies described herein.

DETAILED DESCRIPTION

A module assembly as described herein includes a module that can includea semiconductor die encapsulated in a molding material, and a directbonded metal (DBM) substrate electrically coupled to the semiconductordie. The module assembly can include a cover around at least a portionof the module such that a heat-transfer mechanism is disposed within achannel of the cover. The heat-transfer mechanism can be, or caninclude, a heatsink, protrusions extending from the cover, and/or soforth. The module assemblies described herein can be configured asdual-cool module assemblies, and the modules can have more than one DBMsubstrate.

The module assemblies described herein can be configured to provideadequate cooling for modules while meeting size and cost objectives forthe module assemblies. In some implementations, heat-transfer mechanisms(e.g., heatsinks) included in the module assemblies can be fabricatedusing a metallic material. In order to reduce overall module assemblycosts, however, heat-transfer mechanisms can be fabricated as compositemetal and plastic structures or, in some cases, as just plasticstructures.

In some implementations, the heat-transfer mechanisms can providenon-direct cooling to the components included in the module assemblies.In some implementations, the heat-transfer mechanisms for a moduleassembly can provide direct cooling to the components included in themodule assemblies using a dual-sided cooling module. In someimplementations, heat-transfer mechanisms in the module assemblies canprovide a combination of non-direct and direct cooling to the componentsincluded in the module assemblies. Such heat-transfer mechanisms can bereferred to as a hybrid heat-transfer mechanism or a hybridheat-transfer structure.

A hybrid heat-transfer mechanism can provide high performance cooling ata low cost because the hybrid heat-transfer mechanism can be designedand assembled to provide direct cooling, can include protrusions (e.g.,fin) attached to a direct bonded metal (DBM) substrate (e.g., directedbonded copper (DBC) substrate, a substrate with a dielectric layerdisposed between two metal layers (e.g., one or more metal layers withelectrical traces)), and can include a tubular heat-transfer design foruse by dual cooling modules. In some implementations, the hybridheat-transfer mechanism can eliminate the use of a thermal interfacematerial (TIM) between the DBC substrate and a copper base plate.

The module assemblies described herein can include the use of the hybridheat-transfer mechanisms including leakage prevention of the liquidcoolant along with package alignment in a molded fully plasticstructure. The molded fully plastic structure for the hybridheat-transfer mechanisms can provide improved creepage distances betweencomponents as compared to conventional structures. The molded fullyplastic structure can provide scalability for one to three or moremodules, allowing horizontal and/or vertical stack-up of the modules.The hybrid heat-transfer mechanisms described herein can provideimproved thermal performance reducing a die size for the overall moduleassembly while providing an improvement to a maximum current capabilityfor the module assembly.

For example, heat-transfer mechanisms described herein and, inparticular, a hybrid heat-transfer mechanism can be included in avariety of module assemblies for applications including high-powerdevice applications. For example, the high-power device applications caninclude high power applications greater than, for example, 600 V (e.g.,especially when using silicon carbide (SiC) die) and high powerapplications greater than, for example, 400 V (e.g., when using silicondie). In some implementations, the module assemblies can be included ina variety of applications including, but not limited to, automotiveapplications (e.g., automotive high power modules (AHPM), electricalvehicles, hybrid electrical vehicles), computer applications, industrialequipment, on-board charging applications, inverter applications, and/orso forth.

FIGS. 1A through 1E are diagrams that illustrate various views of amodule assembly 100 according to some implementations. FIGS. 1A and 1Bare diagrams that illustrate cross-sectional views of the moduleassembly 100. FIGS. 1C through 1E are diagrams that illustrate front,side, and top views, respectively, of the module assembly 100. FIG. 1Ais a cross-sectional view cut along line A1 of FIG. 1D, and FIG. 1B is across-sectional view cut along line A2 of FIG. 1E.

As shown in FIG. 1A, the module assembly 100 includes a module 110coupled to a heatsink 130. The heatsink 130 is disposed within a channel124 of a cover 120 (also can be referred to as a module cover). Theheatsink 130 can be referred to as a heat-transfer mechanism (e.g., aheat-transfer element) or can be a type of heat-transfer mechanism. Thecover 120 is disposed around at least a portion of the module 110.

Although the orientation of the devices can be flipped or reversed, tosimplify the description of some of the elements herein, the topdirection will be referenced with respect to top of the page and thebottom direction will be referenced with respect to the bottom of thepage. A direction extending between the top and bottom can be referredto as a vertical direction (Y direction), and a direction (X or Zdirection depending on orientation of the figure) orthogonal to thevertical direction can be referred to as a horizontal direction (orlateral direction).

As shown in FIG. 1B, the cover 120 includes an inlet opening 121 and anoutlet opening 122 such that a fluid (e.g., a gas (e.g., air), water, acoolant) may flow within the channel 124 and around the heatsink 130.Accordingly, the inlet opening 121 can be in fluid communication withthe outlet opening 122 via the channel 124. The openings 121, 122 can bebi-directional openings so that fluid may flow in the opposite directionthrough the channel 124. The openings 121, 122 are openings through atleast a portion (e.g., a wall) of the cover 120.

An example fluid flow direction is illustrated by the dashed line shownin FIG. 1B. In this implementation, heat may be transferred (e.g.,efficiently transferred) away from the module 110 via the heatsink 130and the fluid flowing within the channel 124. The module 110 is alignedalong plane B2 such that the module 110 is aligned along the directionof fluid flow between the inlet opening 121 and the outlet opening 122.

As shown in FIG. 1A, the heatsink includes protrusions 134 (e.g., aplurality of protrusions) and a substrate 132 (also can be referred toas a base plate). Although not shown in FIG. 1A, in someimplementations, a thermal interface material (TIM) can be disposedbetween the heatsink 130 and the module 110 to facilitate heat transferbetween the module 110 and the heatsink 130.

As shown in FIG. 1A, the heatsink 130 is disposed between a wall (e.g.,a top wall) of the cover 120 and the module 110. The heatsink 130 isalso disposed between sidewalls of the cover 120.

The protrusions 134 shown in FIG. 1A extend from the substrate 132toward an inner surface of the cover 120 (along a direction non-parallelto (e.g., orthogonal to) the substrate 132). Because the protrusions 134are included in a heatsink 130, the protrusions 134 can be referred toas heatsink protrusions.

As shown in FIGS. 1A and 1B, the protrusions 134 can be fins includedwithin, or as part of, the heatsink 130. One or more of the protrusions134 can be aligned longitudinally along the direction of the fluid flow.Accordingly, one or more of the protrusions 134 can be alignedlongitudinally between the inlet opening 121 and the outlet opening 122.In some implementations, the heatsink 130 can include more protrusions134 than shown in FIGS. 1A and 1B.

The protrusions 134 as shown in FIG. 1A have a narrow lateral width(along the X direction) relative to a vertical height (along the Ydirection). The protrusions 134 as shown in FIG. 1B have a relativelylong longitudinal length (along the Z direction) relative to the widthor height. In some implementations, the protrusions 134 can have adifferent shape than shown in FIGS. 1A and 1B. Different protrusionshapes are shown and described in more detail below.

In some implementations, the substrate 132 and one or more of theprotrusions 134 can be monolithically formed. In some implementations,one or more of the protrusions 134 can be coupled (e.g., welded,soldered, glued) to the substrate 132. In the implementations describedherein, when a element is coupled to or in contact with another element,the elements can be thermally coupled or thermally contacted via, forexample, a thermal interface material, a solder, a conductive glueand/or so forth.

The heatsink 130 (and portions thereof) can be made of a variety ofmaterials including metallic materials, and/or alloys thereof, (e.g.,copper, aluminum, nickel, nickel-plated metals, etc.). In someimplementations, one or more portions of the heatsink 130 can be made ofa plastic material. In some implementations, the substrate 132 and oneor more of the protrusions 134 can be made of a different material.

Although not shown in FIG. 1A, the module 110 can include one or moresemiconductor die (e.g., silicon semiconductor die, silicon carbide(SiC) semiconductor die). The semiconductor die can be encapsulatedwithin a molding (e.g., a molding material (e.g., an epoxy)) included inmodule 110. The semiconductor die can include a power semiconductor die.In some implementations, the semiconductor die can include a verticalmetal oxide semiconductor field effect transistor (MOSFET) device, abipolar junction transistor (BJT) device, a diode device, anapplication-specific integrated circuit (ASIC), passive components(e.g., resistors, capacitors, inductors), and/or so forth.

Although not shown, in some implementations, the module 110 can includeone or more direct bonded metal (DBM) (e.g., directed bonded copper(DBC)) substrates. For example, a first DBM substrate can be disposed onfirst side of the module 110 and a second DBM substrate can be disposedon a second side of the module 110. Semiconductor die can be disposedwithin the module between the first and second DBM substrates. An outersurface of one or more of the DBM substrates can be exposed and candefine at least a portion of a surface of the module 100. In someimplementations, one or more semiconductor die can be coupled to aninner surface of one or more of the DBM substrates.

In some implementations, the heatsink 130 can be coupled to one of theDBM substrates of the module 110. In some implementations, the modulecan be, for example, an automotive high power module (AHPM) package.

In this implementation, the substrate 132 is aligned along a plane B1and the module 110 is aligned along a plane B2. Accordingly, thesubstrate 132 is aligned parallel to the module 110. In someimplementations, the substrate 132 may not be aligned parallel to themodule 110.

In this implementation, the protrusions 134 of the heatsink 130 arealigned orthogonal to the plane B1. In some implementations, one or moreof the protrusions 134 may not be aligned orthogonal to the plane B1. Insome implementations, a first protrusion from the protrusions 134 may benot be aligned parallel to a second protrusion from the protrusions 134.

As shown in FIG. 1A, a top end of each of the protrusions 134 can bespaced by a gap C1 from a top inner surface of the cover 120. The gap C1can be relatively small (e.g., 3 times or smaller) compared with aheight of the protrusions 134 (to facilitate heat transfer). The topinner surface of the cover can be on an opposite side of the moduleassembly 100 relative to the module 110. The protrusions 134 can bealigned with the side inner surfaces of the cover 120. The top innersurface in the side inner surfaces of the cover 120 can generally definethe boundaries (e.g., top and sides) of the channel 124.

In some implementations, a lateral spacing between the protrusions 134can be equal or unequal. For example, a space between a first pair ofprotrusions 134 can be the same or different as a space between a secondpair of protrusions 134.

In some implementations, the heatsink 130, and/or a portion thereof(e.g., the substrate 132 and/or the protrusions 134), can be entirelydisposed within the channel 124 of the cover 120. In someimplementations, the heatsink 130, and/or a portion thereof, can beentirely disposed within a cavity defined by the module 110 and thecover 120.

As shown in FIGS. 1A through 1D, a sealing mechanism 140 is coupledbetween the cover 120 and the module 110. The sealing mechanism 140 canbe configured to prevent a fluid within the channel 124 from leakingthrough an interface between the cover 120 and the module 110. In thisimplementation, the sealing mechanism 140 is aligned, or disposedwithin, a plane parallel to at least one of plane B1 or plane B2. Insome implementations, the sealing mechanism can be around (e.g.,substantially around) a perimeter (or within or along a perimeter) ofthe module 110. In some implementations, the sealing mechanism can bearound (e.g., substantially around) a perimeter of the cover 120. Insome implementations, the sealing mechanism 140 can be an adhesiveand/or sealant. In some implementations, the sealing mechanism 140 canbe an o-ring disposed within a groove (e.g., dual groove o-ring) of thecover 120. In some implementations, the sealing mechanism 140 may not bedisposed within a groove or a portion of the cover 120. More detailsregarding sealing mechanisms 140 are described below.

The cover 120 can be made of, for example, a plastic material. In someimplementations, the cover 120 can be fabricated by molding a compositematerial. In some implementations, the cover 120 can be made using aninjection molding process. In some implementations, the cover 120 can bemade of, or can include, a metal material (e.g., a metallic alloy,aluminum, copper, steel, and/or so forth). In some implementations, theheatsink 130 can be made of a different (e.g., plastic versus metal) orthe same material than the cover 120.

As shown in FIG. 1A, a lead 150 (also can be referred to as a leadframeportion) can be coupled to or included as part of the module 110. Asemiconductor die included within the module 110 can be electricallycoupled to the lead 150. The lead 150 can function as an electricalconnection (e.g., an input/output (I/O) pin, a power pin, a ground pin,etc.) to the semiconductor die. Although the figures illustrate a singlelead 150, multiple leads can be coupled to the module 110.

The top view of the module assembly 100 shown in FIG. 1E illustrates theinlet opening 121 and the outlet opening 122. In some implementations,the inlet opening 121 and/or the outlet opening 122 can have a differentshape than shown in FIG. 1E. In some implementations, a port can becoupled to one or more of the inlet opening 121 and/or the outletopening 122.

FIGS. 2A and 2B are diagrams that illustrate a variation of the moduleassembly 100 shown in FIGS. 1A through 1E. The module assembly 100excludes a heatsink and instead includes protrusions 134A that extendfrom the cover 120. The protrusions 134A can be referred to as aheat-transfer mechanism or can be a type of heat-transfer mechanism. Theouter views of the module assembly 100 shown in FIGS. 1C and 1E applyalso to the module assembly 100 shown in FIGS. 2A and 2B. The featuresdescribed above in connection with FIGS. 1A through 1E generally applyto the module assembly 100.

As shown in FIGS. 2A and 2B, the protrusions 134A extend from the cover120 toward a top surface (e.g., exposed surface) of the module 110(along a direction non-parallel to (e.g., orthogonal to) the module110). Because the protrusions 134A extend from the cover 120, theprotrusions 134A in this implementation can be referred to as coverprotrusions. In some implementations, one or more of the protrusions134A can be monolithically formed as part of the cover 120. In someimplementations, the protrusions 134A can function as turbulizers. Thecover protrusion implementations can be advantageous in that a thermalinterface material may not be needed (compared with a thermal interfacematerial between a heatsink and the module 110 in heatsinkconfigurations).

As shown in FIG. 2A, the protrusions 134A are disposed between andextend from a wall (e.g., a top wall or portion) of the cover 120 andthe module 110. The protrusions 134A are disposed between and arealigned along sidewalls (e.g., inner surfaces of the sidewalls) of thecover 120.

As shown in FIG. 2A, a bottom end of each of the protrusions 134A can bespaced by a gap D1 from a top surface of the module 110. The gap D1 canbe relatively small (e.g., 3 times or smaller) compared with a height ofthe protrusions 134 (to facilitate heat transfer). The protrusions 134Acan be aligned with the side inner surfaces of the cover 120. In someimplementations, the protrusions 134A can be made of a different (e.g.,plastic versus metal) or the same material as the cover 120.

FIG. 3 is a diagram that illustrates a variation of the protrusions 134Ashown in FIG. 2B. As shown in FIG. 3, the protrusions 134B have anelongate shape. In some implementations, the protrusions 134B can have apillar shape, a cylindrical shape, a tapered shape, a spiral shape,and/or so forth. A cross-sectional profile of one or more of theprotrusions 134B can have a square shape, a circular shape, an ovalshape, rectangular shape, and/or so forth. The protrusions 134B as shownin FIG. 3 have a narrow lateral width (along the X direction) relativeto a vertical height (along the Y direction). The protrusions 134B alsohave a relatively short length (along the Z direction) relative to theheight. In some implementations, the width can be equal to or differentthan the length.

In some implementations, the protrusions 134B (when viewed alongdirection E shown in FIG. 3) can be arranged in a regular pattern, arandom pattern, an irregular pattern, etc. The protrusions 134B can bearranged to mix a fluid flowing through the channel 124 between theinlet opening 121 and the outlet opening 122 to facilitate heattransfer.

FIGS. 4A through 4F are diagrams that illustrate variations of themodule assemblies 100 shown in FIGS. 1A through 3.

As shown in FIGS. 4A and 4B, a vertical height of at least some of theprotrusions 134A and 134, respectively, is different (e.g., taller) thana vertical height of other of the protrusions (as opposed to an evenheight as in the other example implementations). In FIG. 4A, theprotrusions 134A closest to the sidewalls of the cover 120 are tallerthan the protrusions 134A toward the middle portion of the cover 120.Although not shown in FIG. 4A, the protrusions 134A closest to thesidewalls of the cover 120 can be shorter than the protrusions 134Atoward the middle portion of the cover 120.

In FIG. 4B, the protrusions 134 closest to the sidewalls of the cover120 are shorter than the protrusions 134 toward the middle portion ofthe cover 120. Although not shown in FIG. 4B, the protrusions 134closest to the sidewalls of the cover 120 can be taller than theprotrusions 134 toward the middle portion of the cover 120.

FIG. 4C illustrates protrusions 134A that extend from the cover 120 andare in contact with (e.g., in thermal contact with, coupled to) the topsurface of the module 110. In this implementation, less than all of theprotrusions 134A extend from the cover 120 to the top surface of themodule 110. In some implementations, all of the protrusions 134A canextend from the cover 120 to the top surface of the module 110. Athermal interface material can be excluded from a top (upper) surface ofthe module 110.

FIG. 4D illustrates protrusions 134A that extend from the cover 120 andare in contact with a substrate 132, which is disposed between the topsurface of the module 110 and the protrusions 134A. In thisimplementation, less than all of the protrusions 134A extend from thecover 120 top surface of the module 110. In some implementations, all ofthe protrusions 134A can extend from the cover 120 to the top surface ofthe module 110. The protrusions 134A in contact with the substrate 132can maintain the substrate 132 in a fixed position with respect to themodule 110.

FIG. 4E illustrates protrusions 134 that extend from the heatsink 130and are in contact with the top inner surface of the cover 120. In thisimplementation, less than all of the protrusions 134 extend from theheatsink 130 to the top inner surface of the cover 120. In someimplementations, all of the protrusions 134 can extend from the heatsink130 to the top inner surface of the cover 120. The protrusions 134 incontact with the cover 120 can maintain the heatsink 130 in a fixedposition with respect to the module 110.

FIG. 4F illustrates protrusions 134 that extend between substrates 132-1and 132-2. In this implementation, all of the protrusions 134A extendbetween the substrates 132-1 and 132-2. The contact of the heatsink 130between (and with) the inner surface of the cover 120 and the module 110can maintain the heatsink in a desirable fixed position and thermalcontact with the module 110.

In some implementations, less than all of the protrusions 134A extendbetween the substrates 132-1 and 132-2. In some implementations, thesubstrate 132-2 may not be in contact with the cover 120. In otherwords, a top surface of the substrate 132-2 can be separated from thetop inner surface of the cover 120.

FIG. 5 is a diagram that illustrates a variation of the module assembly100. In this implementation, the cover 120 terminates on top of thesubstrate 132 of the heatsink 130. Accordingly a width of the channel124 is less than a width of the substrate 132. The sealing mechanism 140is coupled between at least a portion of the cover 120 and the substrate132. In this implementation, a portion of the substrate 132 is exposedoutside of the cover 120 rather than being entirely enclosed within thecover 120. The substrate 132 is disposed between the cover and themodule 110.

FIG. 6 is a diagram that illustrates another variation of the moduleassembly 100. In this implementation, the cover 120 terminates on top ofthe substrate 132 of the heatsink 130. In this implementation, couplingmechanisms 162 are configured to couple (e.g., fixedly couple) the cover120 to the substrate 132. In this implementation, the substrate 132 canbe fixedly coupled (e.g., welded, soldered, glued) to the module 110.Accordingly, the cover 120 is fixedly coupled within the module assembly100 to the module 110 via the substrate 132. The substrate 132 isdisposed between the cover and the module 110. As shown in FIG. 5, thesealing mechanism 140 is coupled between at least a portion of the cover120 and the substrate 132. In this implementation, a portion of thesubstrate 132 is exposed outside of the cover 120 rather than beingentirely enclosed within the cover 120.

In some implementations, less or more than two coupling mechanisms 162can be used. In some implementations, one or more of coupling mechanism162 can include a screw, a rivet, a clasp, a latch, an anchor, a spring,a glue, a press-fit component, and/or so forth. Although not shown inthis implementation, in some implementations, one or more of thecoupling mechanisms 162 can be disposed within an opening (e.g., anopening through, a hole, a recess) in the cover 120.

FIG. 7 is a diagram that illustrates the variation of the moduleassemblies 100 described herein. FIG. 7 illustrates a module assembly100 that includes dual-sided cooling for the module 110. The featuresshown in FIG. 7 can be applied to any of the implementations describedherein. For example, the implementations described in connection withFIGS. 1 through 6 can be applied in a dual-sided cooling configurationas shown in FIG. 7.

In the implementation shown in FIG. 7, the module assembly 100 includesa first cover 120A, a first channel 124A, and a first sealing mechanism140A disposed on a first side (e.g., a top side) of the module 110 and asecond cover 120B, a second channel 124B, and a second sealing mechanism140B disposed on a second side (e.g., a bottom side) of the module 110.Although not shown, a heat-transfer mechanism such as a heatsink (e.g.,heatsink 130), heatsink protrusions (e.g., protrusions 134), coverprotrusions (e.g., protrusions 134A) and/or so forth can be disposedwithin the channel 124A and/or 124B.

In this implementation, a first DBM substrate 112A (e.g., DBC substrate)and a second DBM substrate 112B of the module 110 are shown. The portion114 disposed between the DBM substrate 112A and the DBM substrate 112Bcan include a semiconductor die, molding material, one or more spacers,a leadframe, and/or so forth.

In this implementation, the first cover 120A (and elements includedwithin the cover 120A) and the second cover 120B (and elements includedwithin the cover 120A) are coupled about the module 110 via couplingmechanisms 160. In some implementations, the first cover 120A and thesecond cover 120B can be coupled in a fixed fashion about the module 110via the coupling mechanisms 160 such that the module 110 is in a fixedposition between the first cover 120A and the second cover 120B. In someimplementations, the covers 120A, 120B are coupled via one or more ofthe coupling mechanisms 160 disposed lateral to the module 110.

In some implementations, less or more than two coupling mechanisms 160can be used. In some implementations, one or more of the couplingmechanisms 160 can include, or can be, a screw (e.g., a spring-loadedscrew), a rivet, a clasp, a latch, an anchor, a spring, a press-fitmechanism, a glue, and/or so forth. Although not shown in thisimplementation, in some implementations, one or more of the couplingmechanisms 160 can be disposed within an opening (e.g., an openingthrough, a hole, a recess) in the cover 120A and/or cover 120B. In someimplementations, one or more coupling mechanisms 160 can be disposedwithin openings and/or recesses within one or more of the covers 120A,120B.

FIG. 8 is a diagram that illustrates another variation of the moduleassembly 100. In this implementation, the module assembly 100 includestwo modules—module 110A and module 110B. The modules 110A, 110B in thisimplementation are aligned along the same plane E1. The modules 110A,110B are also aligned along the direction of fluid flow between theinlet opening 121 and the outlet opening 122. Accordingly, the fluidflow within the channel 124 can be used to transfer heat away from bothof the modules 110A, 110B.

Although not shown, a heatsink (e.g., heatsink 130), heatsinkprotrusions (e.g., protrusions 134), cover protrusions (e.g.,protrusions 134A) and/or so forth can be disposed within the channel124. Although not shown, a heat-transfer mechanism such as a heatsink(e.g., heatsink 130), heatsink protrusions (e.g., protrusions 134),cover protrusions (e.g., protrusions 134A) and/or so forth can bedisposed within the channel 124. A separate heat-transfer mechanism canbe associated with each of the modules 110A, 110B.

As shown in FIG. 8, a different sealing mechanism is associated witheach of the modules 110A, 110B. Specifically, sealing mechanism 140A isassociated with module 110A and sealing mechanism 140B is associatedwith module 110B. Accordingly, each of the modules 110A, 110B can beseparately sealed with respect to the channel 124 and fluid flowingtherethrough. The cover 120 includes a support portion 128 of the cover120 disposed between the modules 110A, 110B.

The module assembly shown in FIG. 8 can also be configured in adual-sided cooling configuration. Such dual-sided configurations areshown in FIGS. 9A and 9B.

As shown in FIG. 9A, the module assembly 100 includes a first cover120A, a first channel 124A, and first sealing mechanisms 140A-1, 140A-2disposed on a first side (e.g., a top side) of the module 110 and asecond cover 120B, a second channel 124B, and second sealing mechanisms140B-1, 140B-2 disposed on a second side (e.g., a bottom side) of themodule 110. Inlet opening 121A and outlet opening 122A are associatedwith channel 124A, and inlet opening 121B and outlet opening 122B areassociated with channel 124B.

This implementation shown in FIG. 9A includes protrusions 134A-1 and134B-1 associated with, and disposed on opposite sides of, module 110Afor dual-sided cooling of module 110A. Similarly, this implementationincludes protrusions 134A-2 and 134B-2 associated with, and disposed onopposite sides of, module 110B for dual-sided cooling of module 110B.

FIG. 9B illustrates a variation of the module assembly 100 shown in FIG.9A with heatsinks 130A-1, 130A-2, 130B-1, 130B-2 rather than coverprotrusions. The common features will not be described again inconnection with FIG. 9A to simplify the description.

The features shown in FIGS. 9A and 9B can be applied to any of theimplementations described herein. For example, the implementationsdescribed in connection with FIGS. 1 through 8 can be applied in thedual-sided cooling configuration shown in FIGS. 9A and 9B.

Although the flow of fluid is shown as being in the same directionwithin the channels 124A, 124B in FIGS. 9A and 9B, in someimplementations, the flow of fluid can be in opposite directions. Forexample, fluid flow can be in a first direction within channel 124A, andfluid flow can be in a second direction opposite the first directionwithin channel 124B.

Although not shown in FIGS. 9A and 9B, different combinations ofheat-transfer mechanisms can be included in the channels 124A, 124B. Forexample, cover protrusions and a heatsink can be associated with module110A and disposed on opposite sides of module 110A. As another example,cover protrusions and a heatsink can be included in a single channel(e.g., channel 124A).

Although not shown in FIGS. 9A and 9B, a single set of inlet and outletopenings can be associated with both channels 124A, 124B. Suchimplementations are described in more detail below (e.g., at least FIGS.13 through 16).

Although not shown in FIG. 9B, a heatsink can be configured to spanacross multiple modules. For example, a single heatsink can beconfigured to span across modules 110A and 110B. In suchimplementations, the sealing mechanisms can be handled differently thanshown in FIG. 9B without a support portion (e.g., support portion 128shown in FIG. 8). Such an example implementation is shown and describedin connection with at least FIG. 16 below.

FIGS. 10 and 11 illustrate examples of heatsinks that can be used toprovide non-direct (e.g., in-direct) cooling for modules (e.g., modules110) within a module assembly (e.g., module assembly 100). FIG. 10illustrates a cross-sectional view 130 of a bi-metal heatsink 1030. Thebi-metal heatsink 1030 can be fabricated without the need for welding,reducing power supply assembly costs and, as such, reducing the overallcost of the power supply. The bi-metal heatsink 1030 can includedifferent types of metals for different portions of the heatsink 1030.

Specifically, the bi-metal heatsink 1030 includes a copper (Cu) baseplate 1032 that can be nickel (Ni) plated, and one or more protrusions1034 a, 1034 b (e.g., fin structures) that can be made of differentmetals—nickel-plated and copper (Cu) foil, respectively. The protrusions1034 a-b can be soldered onto the base plate 1032 using a solder 1031.Therefore, no welding is required. In some cases, the protrusions 1034a-b and the base plate 1032 can be produced separately before assemblyinto the bi-metal heatsink 1030. In this implementation, at least one ofthe protrusions 1034 (or any of the protrusions 134 described herein)has a serpentine structure. In some implementations, all of theprotrusions 1034 can be included in a serpentine structure.

FIG. 11 illustrates a perspective view of an example heatsink 1134. Theheatsink 1134 can be a bi-metal heatsink. As shown in FIG. 11, theprotrusions (e.g., fins) can have different lengths F1, F2 and differentheights G1, G2. Specifically, a first set of the protrusions 1134 (in amiddle portion of the protrusions disposed between outer portions ofprotrusions) has a height G1 that is greater than a height G2 of asecond set of the protrusions 1134 (in an outer portion of theprotrusions). The first set of the protrusions 1134 has a length F1 thatis greater than a length F2 of the second set of the protrusions 1134.The heatsink 1134 also include openings 1135 in the substrate 1132 thatcan be used to couple the heatsink 1134 to, for example, a cover and/ora module.

FIG. 12 is a diagram that illustrates a variation of the module assemblyshown in FIG. 6. In this variation, the cover 120 is coupled to thesubstrate 132 of the heatsink via spring-loaded screws 162-1, 162-2 thatare disposed within recesses 125-1, 125-2. The sealing mechanism 140 canbe disposed within a groove 1226 (e.g., a recess) within the cover 120.Leakage from the channel 124 can be reduced, prevented, or eliminated byusing the sealing mechanism 140 with the spring-loaded screws 125-1,125-2.

A thermal interface material (TIM) 1211 can be disposed between thesubstrate 132 of the heatsink 130 and the module 110 (e.g., a DBMsubstrate of the module 110). In this implementation, the cover 120 canbe coupled to (e.g., screwed to, fixedly coupled to) a subcomponent thatincludes the heatsink 130, the TIM 1211 and the module 110.

FIG. 13 illustrates an exploded view of components included in a moduleassembly 100. The module assembly 100 includes a first cover 120A and asecond cover 120B. The module assembly 100 includes heat-transfermechanisms 130A-1 through 130A-3 on one side of the modules 1310Athrough 1310C and heat-transfer mechanisms 130B-1 through 130B-3. Inthis implementation, the heat-transfer mechanisms 130A-1 through 130A-3and 130B-1 through 130B-3 are heatsinks.

An inlet opening 121A (and port) and an outlet opening 122A (and port)are included in the cover 120A for fluid flow through channels in thecovers 120A, 120B. A channel 124B within cover 120B is shown in FIG. 13,and a channel within cover 120A is not visible in FIG. 13. An inletopening 121B and an outlet opening 122B are included in the cover 120Bfor fluid flow to be received from the cover 120A and into the channel124B. The inlet opening 121B and an outlet opening 122B are in fluidcommunication with the channel 124B. When assembled, the inlet opening121A and the outlet opening 122A are in fluid communication with thechannel 124B because the openings 121A and 122A are through the entiretyof the cover 120A (and provide access to the openings 121B, 122B).

For example, a fluid may flow from the inlet opening 121A of cover 120Athrough opening 121B and along the double-sided arrow disposed withinthe channel 124B shown in FIG. 13. The fluid may flow from the outletopening 122B of cover 120B through opening 122A of the cover 120A.

Grooves 1341B-1 through 1341B-3 (also can be referred to as recesses)for sealing mechanisms are included in the cover 120B. Grooves 1343-1and 1343-2 (also can be referred to as recesses) are included in thecover 120B so that the openings 121A, 122A of cover 120A can be sealedto the openings 121B, 122B of cover 120B. An o-ring, a sealant, or someother material may be disposed in one or more of the grooves 1341B-1through 1341B-3 and/or 1343-1, 1343-2.

The covers 120A, 120B includes flanges 1365A, 1365B, respectively. Thecovers 120A, 120B (and the components included therein or therebetween(e.g., modules)) can be coupled using the flanges 1365A, 1365B.Specifically, a coupling mechanism (such as those described above)(e.g., a screw, a rivet, etc.) can be used to couple the covers 120A,120B via the flanges 1365A, 1365B.

As shown in FIG. 13, each of the covers includes openings that areassociated with each of the modules. For example, opening 1329B isincluded in the cover 120B and is associated with heatsink 130B-3 andmodule 13010A. The heatsink 130B-3 can be disposed within the opening1329B. The opening 1329B is in fluid communication with the channel 124Band the openings 121B and 122B. In this implementation, the groove1341B-1 (and/or sealing mechanism) defines a perimeter around or alongthe opening 1329B.

FIG. 14 is a diagram that illustrates a side view of an example moduleassembly 100 that can be a variation of the module assembly shown inFIG. 13. In this diagram all of the components of FIG. 13 are coupledtogether. Leads 1350A through 1350C of the modules 1310A through 1310Care shown.

FIGS. 15 and 16 illustrate side cross-sectional views of example moduleassemblies 100 similar to those shown in FIGS. 13 and 14, and can bevariations of the other module assemblies 100 described above. Themodule assembly 100 shown in FIG. 15 includes a first cover 120A coupledto a second cover 120B. The module assembly 100 includes a set ofheat-transfer mechanisms 1530A-1 through 1530A-3 on one side of modules1510A through 1510C and a set of heat-transfer mechanisms 1530B-1through 1530B-3. In this implementation, the heat-transfer mechanisms1530A-1 through 1530A-3 and 1530B-1 through 1530B-3 are coverprotrusions. Each of the modules 1510A through 1510C can be a module fordual-sided cooling and can include one or more DBM substrates (e.g., DBCsubstrates). Sealing mechanisms 1540 (only a few are labeled) are usedto seal the elements includes in this module assembly 100.

An inlet opening 121A (and port) and an outlet opening 122A (and port)are included in the cover 120A for fluid flow through the channels1524A, 1524B in the covers 120A, 120B. The fluid flow within the moduleassembly 100 is illustrated by the arrows. The covers 120A, 120B shownin FIG. 15 can be made of, for example, a composite plastic material.

The module assembly 100 shown in FIG. 16 includes a first cover 120Acoupled to a second cover 120B. The module assembly 100 includes aheat-transfer mechanism 1630A on one side of modules 1610A through 1610Cand a heat-transfer mechanism 1630B. In this implementation, theheat-transfer mechanisms 1630A, 1630B are heatsinks. Each of the modules1610A through 1610C can be a module for dual-sided cooling and caninclude one or more DBM substrates (e.g., DBC substrates).

In some implementations, the heatsinks 1630A, 1630B, respectively, canbe integrated into the covers 120A, 120B. In some implementations, theheatsinks 1630A, 1630B, respectively, can be monolithically formedwithin the covers 120A, 120B. In some implementations, the covers 120A,120B shown in FIG. 16 can be made of, for example, a metallic material.

As shown in FIG. 16, the heatsinks 1630A, 1630B span across all of themodules 1610A through 1610C. This is enabled by the structure of innerwalls 1625A, 1625B, respectively, of the covers 120A, 120B.Specifically, the heatsinks are in contact with (e.g., coupled to) innerwalls 1625A, 1625B, respectively, of the covers 120A, 120B. The innerwalls 1625A, 1625B are in contact with the modules 1610A through 1610C.Accordingly, when the covers 120A, 120B are coupled together as shown inFIG. 16, the inner walls 1625A, 1625B define a cavity 1637 (e.g., aspace) within which the modules 1610A through 1610C are disposed. Theheight of the cavity 1637 can be large enough that the modules 1610Athrough 1610C may be disposed therein.

In this implementation, the inner walls 1625A, 1625B can function as asubstrate of a heatsink. In some implementations, one or more of theinner walls 1625A, 1625B can be replaced by a substrate of a heatsink.In some implementations, one or more of the inner walls 1625A, 1625B candefines portions of channels of the respective covers 120A, 120B.

As shown in FIG. 16, a thermal interface material is disposed betweeneach of the modules 1610A through 1610C and inner walls 1625A, 1625B.For example, a thermal interface material 1614A-2 is disposed betweenthe inner wall 1625A of the cover 120A and the module 1610B. Similarly,a thermal interface material 1614B-2 is disposed between the inner wall1625B of the cover 120B and the module 1610B.

Sealing mechanisms 1640 (only a few are labeled) are used to seal theelements includes in this module assembly 100. Because of theconfiguration with the cavity 1637, the sealing mechanisms 1640 are usedfor fluid flow between the openings 121A, 122B, but are not includedbetween the modules 1610A through 1610C.

FIG. 17 is a diagram that illustrates a cover 120A and a cover 120B thatincludes cover protrusions 1734 (e.g., protrusions 1734A-1 through1734A-3 associated with cover 120A and protrusions 1734B-1 through1734B-3 associated with cover 120B). The covers 120A, 120B can be usedin any of the module assembly implementations described herein includingcover protrusions. The cover protrusions 1734 in this implementation arepillar-like structures and are defined within sets that can berespectively associated with each of the modules. For example, the coverprotrusions 1734A-2 are a set of protrusions that can be associated witha first module, and the cover protrusions 1734A-3 are a set ofprotrusions that can be associated with a second module.

FIGS. 18A through 18H illustrate a method of manufacturing at least someof the heatsink-based module assemblies 100 described herein. Themanufacturing process is illustrated in cross-sectional views.

FIG. 18A illustrates a heatsink 1830 with protrusions 1834 coupled to asubstrate 1832. The protrusions 1834 (e.g., a serpentine protrusion, acopper pin foil that is nickel plated) can be coupled to the substrate1832 (e.g., a copper base plate that is nickel plated) via a solder 1833that is printed or dispensed on the substrate 1832. The solder 1833 canbe reflowed after the protrusions 1834 are coupled to the substrate 1832via the solder 1833.

FIG. 18B illustrates a cover 1820A (e.g., top cover) and a cover 1820B(e.g., bottom cover). An example of a sealing mechanism 1840 that can beincluded in grooves 1826A, 1826B (e.g., recesses) of the covers 1820A,1820B, respectively, is illustrated.

FIG. 18C illustrates that heatsinks 1830A, 1830B are coupled to thecovers 1820A, 1820B with at least a portion of the heat sinks 1830A,1830B being disposed within channels 1824A, 1824B. The combination ofthe covers 1820A, 1820B and heatsinks 1830A, 1830B defines coversub-assemblies 1870A, 1870B. The cover 1820A includes an inlet opening122A.

FIG. 18D illustrates a module 1810 that includes DBM substrates 1814A,1814B. The module 1810 can include one or more semiconductor die.

FIG. 18E illustrates a module sub-assembly 1871 including thermalinterface material layers 1811A, 1811B formed on (e.g., printed onto) atleast the DBM substrates of the module 1810. In some implementations, aconnection pad can be coupled to the DBM substrates instead of thethermal interface material layers 1811A, 1811B.

FIG. 18F illustrates the cover sub-assembly 1870B coupled to a firstside of the module sub-assembly 1871 (such that the substrate of theheatsink 1830B is coupled to DBM substrate 1814B via the TIM 1811B).FIG. 18G illustrates the cover sub-assembly 1870A coupled to a secondside of the module sub-assembly 1871.

FIG. 18H illustrates the final module assembly 100 being formed viacoupling mechanisms 1862-1, 1862-2 coupling the cover 1820A to the cover1820B. In this implementation, the coupling mechanisms 1862-1, 1862-2are disposed within (e.g., coupled within) holes through the cover 1820Aand disposed within recesses within the cover 1820B.

FIGS. 19A through 19F illustrate a method of manufacturing at least someof heatsink-based module assemblies 100 described herein. Themanufacturing process is illustrated in cross-sectional views.

FIG. 19A illustrates a module 1910 that includes DBM substrates 1914A,1914B. The module 1910 can include one or more semiconductor die. Inthis implementation, the DBM substrates 1914A, 1914B can be plated(e.g., nickel plated) with a metal so that heatsinks can be directlycoupled (e.g., bonded) to the DBM substrates 1914A, 1914B before coversare installed.

FIG. 19B illustrates a heatsink 1930A with protrusions 1934A coupled tothe DBM substrate 1914A. The heatsink 1930A is manufactured directly onthe module 1910. The protrusions 1934A (e.g., a serpentine protrusion, acopper pin foil that is nickel plated) can be coupled to the DBMsubstrate 1914A via a solder 1933A that is printed or dispensed on theDBM substrate 1914A. The solder 1933A can be reflowed after theprotrusions 1934A are coupled to the DBM substrate 1914A via the solder1933A.

FIG. 19C illustrates a heatsink 1930B with protrusions 1934B coupled tothe module 1910 via a solder 1933B using a methodology similar to thatdescribed in connection with the formation of the heatsink 1930A. Thesub-assembly shown in FIG. 19C can be referred to as a heatsink-modulesub-assembly 1980.

FIGS. 19D and 19E illustrate, respectively, a cover 1920B (e.g., bottomcover) and a cover 1920A (e.g., top cover) coupled to theheatsink-module sub-assembly 1980. In some implementations, cover 1920Acan be coupled to the heatsink-module sub-assembly 1980 before the cover1920B.

Similar to that described in connection with FIGS. 18A through 18H, asealing mechanism can be included in grooves (e.g., recesses) of thecovers 1920A, 1920B illustrated.

The final module assembly 100 shown in FIG. 19F can be formed viacoupling mechanisms 1962-1, 1962-2 coupling the cover 1920A to the cover1920B similar to the fashion described in connection with FIG. 18H. Inthis implementation, the coupling mechanisms 1962-1, 1962-2 are disposedwithin (e.g., coupled within) holes through the cover 1920A and disposedwithin recesses within the cover 1920B.

FIGS. 20A through 20D illustrate a method of manufacturing at least someof cover-protrusion module assemblies 100 described herein. Themanufacturing process is illustrated in cross-sectional views.

FIG. 20A illustrates a cover 2020A (e.g., top cover) and a cover 2020B(e.g., bottom cover) with cover protrusions 2034A, 2034B. An example ofa sealing mechanism 2040 that can be included in grooves 2026A, 2026B(e.g., recesses) of the covers 2020A, 2020B, respectively, isillustrated.

FIG. 20B illustrates the cover 1820B coupled to a module 2010 thatincludes DBM substrates 2014A, 2014B. The module 2010 can include one ormore semiconductor die. FIG. 20C illustrates the cover 1820A coupled toa module 2010. In some implementations, cover 2020A can be coupled tothe module 2010 before the cover 2020B.

The final module assembly 100 shown in FIG. 20D can be formed viacoupling mechanisms 2062-1, 2062-2 coupling the cover 2020A to the cover2020B similar to the fashion described in connection with FIGS. 18H and19F. In this implementation, the coupling mechanisms 2062-1, 2062-2 aredisposed within (e.g., coupled within) holes through the cover 2020A anddisposed within recesses within the cover 2020B.

FIG. 21 is a diagram that illustrates an example module 2110. The module2110 that includes DBM substrates 2114A, 2114B. The module 2110 caninclude one or more semiconductor die.

FIG. 22 is a flowchart that illustrates a method for manufacturing themodule assemblies described herein. As shown in FIG. 22, the method caninclude forming a module including a semiconductor die and a directbonded metal substrate (block 2200). The semiconductor die can beencapsulated in a molding material within the module. The direct bondedmetal substrate can have an inner surface electrically coupled to thesemiconductor die.

As shown in FIG. 22, the method can include coupling a cover around atleast a portion of the module such that a heat-transfer mechanism isdisposed within a channel of the cover between a wall of the cover andthe module (block 2210). In some implementations, the heat-transfermechanism is a heatsink coupled to the cover or the module before thecover is coupled around the module. In some implementations, theheat-transfer mechanism includes a cover protrusion extending from thecover.

It will be understood that, in the foregoing description, when anelement is referred to as being on, connected to, electrically connectedto, coupled to, or electrically coupled to another element, it may bedirectly on, connected or coupled to the other element, or one or moreintervening elements may be present. In contrast, when an element isreferred to as being directly on, directly connected to or directlycoupled to another element, there are no intervening elements present.Although the terms directly on, directly connected to, or directlycoupled to may not be used throughout the detailed description, elementsthat are shown as being directly on, directly connected or directlycoupled can be referred to as such. The claims of the application, ifany, may be amended to recite exemplary relationships described in thespecification or shown in the figures.

As used in this specification, a singular form may, unless definitelyindicating a particular case in terms of the context, include a pluralform. Spatially relative terms (e.g., over, above, upper, under,beneath, below, lower, and so forth) are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. In some implementations, therelative terms above and below can, respectively, include verticallyabove and vertically below. In some implementations, the term adjacentcan include laterally adjacent to or horizontally adjacent to.

Implementations of the various techniques described herein may beimplemented in (e.g., included in) digital electronic circuitry, or incomputer hardware, firmware, software, or in combinations of them. Someimplementations may be implemented using various semiconductorprocessing and/or packaging techniques. Some implementations may beimplemented using various types of semiconductor processing techniquesassociated with semiconductor substrates including, but not limited to,for example, Silicon (Si), Gallium Arsenide (GaAs), Gallium Nitride(GaN), Silicon Carbide (SiC) and/or so forth.

While certain features of the described implementations have beenillustrated as described herein, many modifications, substitutions,changes and equivalents will now occur to those skilled in the art. Itis, therefore, to be understood that the appended claims are intended tocover all such modifications and changes as fall within the scope of theimplementations. It should be understood that they have been presentedby way of example only, not limitation, and various changes in form anddetails may be made. Any portion of the apparatus and/or methodsdescribed herein may be combined in any combination, except mutuallyexclusive combinations. The implementations described herein can includevarious combinations and/or sub-combinations of the functions,components and/or features of the different implementations described.

What is claimed is:
 1. An apparatus, comprising: a module including asemiconductor die; a heatsink coupled to the module and including: asubstrate, and a plurality of protrusions; a first cover defining afirst channel, the plurality of protrusions of the heatsink beingdisposed within the first channel defined by the first cover; a secondcover defining a second channel, the first cover being coupled to themodule and in contact with the module via a sealing mechanism disposedbetween the first cover and the module, the module separating the firstchannel from the second channel.
 2. The apparatus of claim 1, whereinthe first cover includes an inlet opening and an outlet opening in fluidcommunication with the inlet opening via the first channel.
 3. Theapparatus of claim 1, wherein the heatsink is a first heatsink, thefirst cover and the first heatsink are on a first side of the module,the apparatus, further comprising: a second heatsink coupled to a secondside of the module, the second heatsink being disposed within the secondchannel.
 4. The apparatus of claim 3, wherein the first cover is coupledto the second cover via a coupling mechanism disposed lateral to themodule.
 5. The apparatus of claim 1, wherein the module is a firstmodule, the heatsink is a first heatsink, the apparatus furthercomprising: a second module; a second heatsink coupled to the secondmodule, the second heatsink having a plurality of protrusions within thefirst channel, the first heatsink and the second heatsink being alignedalong the first channel.
 6. The apparatus of claim 1, wherein theplurality of protrusions including at least one protrusion having an endseparated from an inner surface of the first channel by a gap.
 7. Theapparatus of claim 1, wherein the sealing mechanism is in contact withthe substrate of the heatsink.
 8. The apparatus of claim 1, furthercomprising: a coupling mechanism coupling the first cover to thesubstrate of the heatsink.
 9. The apparatus of claim 1, wherein thesealing mechanism is in contact with at least a portion of the module.10. The apparatus of claim 1, wherein the sealing mechanism includes ano-ring disposed within a groove included in the first cover.
 11. Theapparatus of claim 1, wherein the module is aligned along a first plane,the sealing mechanism is aligned along a second plane, the sealingmechanism is disposed along a perimeter of the module.
 12. The apparatusof claim 1, wherein the heatsink includes a first metal and a secondmetal.
 13. The apparatus of claim 1, wherein the module is a dual-sidedmodule including a direct bonded metal substrate.
 14. The apparatus ofclaim 1, wherein the module includes a direct bonded metal substrate incontact with the semiconductor die, the direct bonded metal substrateincludes a dielectric layer disposed between a pair of metal layers. 15.An apparatus, comprising: a module including a semiconductor die; afirst cover including: a first channel defined by the first cover, and aplurality of protrusions extending from an inner surface of the firstcover into the first channel; a second cover including a second channel,the first cover being coupled to the module and in contact with themodule via a sealing mechanism disposed between the first cover and themodule, the module separating the first channel from the second channel.16. The apparatus of claim 15, wherein an end of at least one of theplurality of protrusions is separated from a surface of the module by agap.
 17. The apparatus of claim 15, wherein the first cover includes aninlet opening and an outlet opening in fluid communication with theinlet opening via the first channel.
 18. The apparatus of claim 15,wherein the first cover includes an inlet opening and an outlet openingin fluid communication with the inlet opening via the first channel, themodule is a first module, the apparatus, further comprising: a secondmodule, the first module and the second module being aligned along thefirst channel between the inlet opening and the outlet opening.
 19. Amethod comprising: forming a module including: a semiconductor dieencapsulated in a molding material, and a direct bonded metal substratehaving an inner surface electrically coupled to the semiconductor die;and coupling a first cover to at least a first portion of the module anda second cover to at least a second portion of the module such that: aheat-transfer mechanism is disposed within a first channel defined bythe first cover between a wall of the first cover and the module, andthe module separates the first channel from a second channel defined bythe second cover.
 20. The method of claim 19, wherein the heat-transfermechanism is a heatsink coupled to the first cover or the module beforethe first cover is coupled around the module.
 21. The method of claim19, wherein the heat-transfer mechanism includes a cover protrusionextending from the first cover.